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There have been posts on head-fi and ASR that describe a pretty significant quality defect with the DX7S. Two heatsinks on high power components are poorly attached. This may well cause units to fail very early if you are using the headphone outputs (not clear if it is an issue if just used as a DAC).
If you search for this issue you will find the suggested fix. Doesn’t sound too hard to fix, and I will be taking my unit apart to see if it suffers from the same defect and installing the fix myself if it does.
As a follow-up, I took my unit apart. The two heatsinks were firmly attached and making good contact to the four chips they are intended to cool. However, there was no thermal paste, pad, or tape to ensure a good thermal connection, so I added thermal pads to the four chips out of an abundance of caution.